|
|
|
|
|
|
|
|
1. |
Record Nr. |
UNINA9910454375803321 |
|
|
Autore |
Paik Philip Y. |
|
|
Titolo |
Adaptive cooling of integrated circuits using digital microfluidics / / Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula |
|
|
|
|
|
|
|
Pubbl/distr/stampa |
|
|
Norwood, Massachusetts : , : Artech House, , ©2007 |
|
[Piscataqay, New Jersey] : , : IEEE Xplore, , [2007] |
|
|
|
|
|
|
|
|
|
ISBN |
|
|
|
|
|
|
Descrizione fisica |
|
1 online resource (203 p.) |
|
|
|
|
|
|
Collana |
|
Artech House integrated microsystems series |
|
|
|
|
|
|
Altri autori (Persone) |
|
ChakrabartyKrishnendu |
PamulaVamsee K |
|
|
|
|
|
|
|
|
Disciplina |
|
|
|
|
|
|
|
|
Soggetti |
|
Integrated circuits - Cooling |
Integrated circuits - Design and construction |
Microfluidics |
Electronic books. |
|
|
|
|
|
|
|
|
Lingua di pubblicazione |
|
|
|
|
|
|
Formato |
Materiale a stampa |
|
|
|
|
|
Livello bibliografico |
Monografia |
|
|
|
|
|
Note generali |
|
Description based upon print version of record. |
|
|
|
|
|
|
Nota di bibliografia |
|
Includes bibliographical references and index. |
|
|
|
|
|
|
Nota di contenuto |
|
Adaptive Cooling of Integrated Circuits Using Digital Microfluidics; Contents 5; Preface 11; Chapter 1 Thermal Management of Integrated Circuits 15; Chapter 2 Cooling Devices for Integrated Circuits 33; Chapter 3 Adaptive Hot-Spot Cooling Principles and Design 49; Chapter 4 Technology Development 77; Chapter 5 Thermal Effects of Digital Microfluidic Devices 105; Chapter 6 Flow-Through-Based Adaptive Cooling 117; Chapter 7 Programmable Thermal Switch-Based Adaptive Cooling 145; Chapter 8 Concluding Remarks 161; Appendix A Image Analysis Software Using MATLAB 167. |
|
|
|
|
|
|
|
|
Sommario/riassunto |
|
Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this |
|
|
|
|