1.

Record Nr.

UNINA9910454375803321

Autore

Paik Philip Y.

Titolo

Adaptive cooling of integrated circuits using digital microfluidics / / Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula

Pubbl/distr/stampa

Norwood, Massachusetts : , : Artech House, , ©2007

[Piscataqay, New Jersey] : , : IEEE Xplore, , [2007]

ISBN

1-59693-139-6

Descrizione fisica

1 online resource (203 p.)

Collana

Artech House integrated microsystems series

Altri autori (Persone)

ChakrabartyKrishnendu

PamulaVamsee K

Disciplina

620.106

621.3815

Soggetti

Integrated circuits - Cooling

Integrated circuits - Design and construction

Microfluidics

Electronic books.

Lingua di pubblicazione

Inglese

Formato

Materiale a stampa

Livello bibliografico

Monografia

Note generali

Description based upon print version of record.

Nota di bibliografia

Includes bibliographical references and index.

Nota di contenuto

Adaptive Cooling of Integrated Circuits Using Digital Microfluidics; Contents 5; Preface 11; Chapter 1 Thermal Management of Integrated Circuits 15; Chapter 2 Cooling Devices for Integrated Circuits 33; Chapter 3 Adaptive Hot-Spot Cooling Principles and Design 49; Chapter 4 Technology Development 77; Chapter 5 Thermal Effects of Digital Microfluidic Devices 105; Chapter 6 Flow-Through-Based Adaptive Cooling 117; Chapter 7 Programmable Thermal Switch-Based Adaptive Cooling 145; Chapter 8 Concluding Remarks 161; Appendix A Image Analysis Software Using MATLAB 167.

Sommario/riassunto

Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this



groundbreaking technology. After reviewing cooling.