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1. |
Record Nr. |
UNINA9910454375803321 |
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Autore |
Paik Philip Y. |
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Titolo |
Adaptive cooling of integrated circuits using digital microfluidics / / Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula |
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Pubbl/distr/stampa |
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Norwood, Massachusetts : , : Artech House, , ©2007 |
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[Piscataqay, New Jersey] : , : IEEE Xplore, , [2007] |
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ISBN |
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Descrizione fisica |
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1 online resource (203 p.) |
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Collana |
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Artech House integrated microsystems series |
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Altri autori (Persone) |
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ChakrabartyKrishnendu |
PamulaVamsee K |
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Disciplina |
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Soggetti |
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Integrated circuits - Cooling |
Integrated circuits - Design and construction |
Microfluidics |
Electronic books. |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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Adaptive Cooling of Integrated Circuits Using Digital Microfluidics; Contents 5; Preface 11; Chapter 1 Thermal Management of Integrated Circuits 15; Chapter 2 Cooling Devices for Integrated Circuits 33; Chapter 3 Adaptive Hot-Spot Cooling Principles and Design 49; Chapter 4 Technology Development 77; Chapter 5 Thermal Effects of Digital Microfluidic Devices 105; Chapter 6 Flow-Through-Based Adaptive Cooling 117; Chapter 7 Programmable Thermal Switch-Based Adaptive Cooling 145; Chapter 8 Concluding Remarks 161; Appendix A Image Analysis Software Using MATLAB 167. |
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Sommario/riassunto |
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Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this |
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groundbreaking technology. After reviewing cooling. |
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2. |
Record Nr. |
UNINA9910139586503321 |
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Autore |
Barron Randall F |
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Titolo |
Design for Thermal Stresses [[electronic resource]] |
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Pubbl/distr/stampa |
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ISBN |
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1-5231-2346-X |
1-283-26815-9 |
9786613268150 |
1-118-09316-X |
1-118-09318-6 |
1-118-09430-1 |
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Descrizione fisica |
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1 online resource (530 p.) |
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Classificazione |
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Altri autori (Persone) |
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Disciplina |
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Soggetti |
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Science -- Dynamics |
Science -- Mechanics |
Science -- Thermodynamics |
SCIENCE / Mechanics / Dynamics / Thermodynamics |
Thermal stresses |
Civil & Environmental Engineering |
Engineering & Applied Sciences |
Civil Engineering |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di contenuto |
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Design for Thermalstresses; Contents; Preface; Nomenclature; 1 Introduction; 1.1 Definition of Thermal Stress; 1.2 Thermal-Mechanical Design; 1.3 Factor of Safety in Design; 1.4 Thermal Expansion Coefficient; 1.5 Young's Modulus; 1.6 Poisson's Ratio; 1.7 Other Elastic Moduli; 1.8 Thermal Diffusivity; 1.9 Thermal Shock Parameters; 1.10 Historical Note; Problems; References; 2 Thermal Stresses in Bars; 2.1 |
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Stress and Strain; 2.2 Bar between Two Supports; 2.3 Bars in Parallel; 2.4 Bars with Partial Removal of Constraints; 2.5 Nonuniform Temperature Distribution; 2.6 Historical Note; Problems |
References3 Thermal Bending; 3.1 Limits on the Analysis; 3.2 Stress Relationships; 3.3 Displacement Relations; 3.4 General Thermal Bending Relations; 3.5 Shear Stresses; 3.6 Beam Bending Examples; 3.7 Thermal Bowing of Pipes; 3.8 Historical Note; Problems; References; 4 Thermal Stresses in Trusses and Frames; 4.1 Elastic Energy Method; 4.2 Unit-Load Method; 4.3 Trusses with External Constraints; 4.4 Trusses with Internal Constraints; 4.5 The Finite Element Method; 4.6 Elastic Energy in Bending; 4.7 Pipe Thermal Expansion Loops; 4.8 Pipe Bends; 4.9 Elastic Energy in Torsion |
4.10 Historical NoteProblems; References; 5.1 Introduction; 5.2 Strain Relationships; 5.3 Stress Relationships; 5.4 Stress-Strain Relations; 5.5 Temperature Field Equation; 5.6 Reduction of the Governing Equations; 5.7 Historical Note; Problems; References; 6 Plane Stress; 6.1 Introduction; 6.2 Stress Resultants; 6.3 Circular Plate with a Hot Spot; 6.4 Two-Dimensional Problems; 6.5 Plate with a Circular Hole; 6.6 Historical Note; Problems; References; 7 Bending Thermal Stresses in Plates; 7.1 Introduction; 7.2 Governing Relations for Bending of Rectangular Plates |
7.3 Boundary Conditions for Plate Bending7.4 Bending of Simply-Supported Rectangular Plates; 7.5 Rectangular Plates with Two-Dimensional Temperature Distributions; 7.6 Axisymmetric Bending of Circular Plates; 7.7 Axisymmetric Thermal Bending Examples; 7.8 Circular Plates with a Two-Dimensional Temperature Distribution; 7.9 Historical Note; Problems; References; 8 Thermal Stresses in Shells; 8.1 Introduction; 8.2 Cylindrical Shells with Axisymmetric Loading; 8.3 Cooldown of Ring-Stiffened Cylindrical Vessels; 8.4 Cylindrical Vessels with Axial Temperature Variation; 8.5 Short Cylinders |
8.6 Axisymmetric Loading of Spherical Shells8.7 Approximate Analysis of Spherical Shells under Axisymmetric Loading; 8.8 Historical Note; Problems; References; 9 Thick-Walled Cylinders and Spheres; 9.1 Introduction; 9.2 Governing Equations for Plane Strain; 9.3 Hollow Cylinder with Steady-State Heat Transfer; 9.4 Solid Cylinder; 9.5 Thick-Walled Spherical Vessels; 9.6 Solid Spheres; 9.7 Historical Note; Problems; References; 10 Thermoelastic Stability; 10.1 Introduction; 10.2 Thermal Buckling of Columns; 10.3 General Formulation for Beam Columns; 10.4 Postbuckling Behavior of Columns |
10.5 Lateral Thermal Buckling of Beams |
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Sommario/riassunto |
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The tools engineers need for effective thermal stress design Thermal stress concerns arise in many engineering situations, from aerospace structures to nuclear fuel rods to concrete highway slabs on a hot summer day. Having the tools to understand and alleviate these potential stresses is key for engineers in effectively executing a wide range of modern design tasks. Design for Thermal Stresses provides an accessible and balanced resource geared towards real-world applications. Presenting both the analysis and synthesis needed for accurate design, the book emphasizes key principles, |
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