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Record Nr. |
UNINA9910449978103321 |
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Titolo |
Substrate technology [[electronic resource]] |
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Pubbl/distr/stampa |
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Bradford, England, : Emerald Group, 2004 |
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ISBN |
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1-280-51439-6 |
9786610514397 |
1-84544-175-3 |
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Descrizione fisica |
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1 online resource (86 p.) |
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Collana |
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Circuit World. No. 4 ; ; Vol. 30 |
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Disciplina |
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Soggetti |
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Electronic circuits |
Materials science |
Electronic books. |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di contenuto |
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Contents; English - Abstracts & keywords; French - Abstracts & keywords; German - Abstracts & keywords; Contributors; Editorial; High frequency PCB base materials - a comparison of thermomechanical properties; High performance epoxy copper clad laminate; High-performance substrate from new epoxy resin and enhanced copper foil; An innovative "Chemical Via" process for the production of high density interconnect printed circuit boards; An introduction to high performance laminates and the importance of using optimised chemical processes in PCB fabrication |
A novel method for sequentially-building multi-layer circuits using LCP laminates, cap-layers and bond plysPCB drillability: a material science approach to resin development; What share of the global upturn can Europe retain?; Internet commentary; Book reviews; Intellect commentary; Company profile; Association news; New products; Industry news; Exhibitions and conferences; Appointments; International diary |
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Sommario/riassunto |
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There is increasing customer demand for materials with low dissipation factors for reduced loss along the traces and low dielectric constants for higher signal propagation speeds. High performance epoxies such |
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