1.

Record Nr.

UNINA9910449844603321

Titolo

Computational modelling [[electronic resource] /] / guest editor, Chris Bailey

Pubbl/distr/stampa

Bradford, England, : Emerald Group Publishing, c2002

ISBN

1-280-47971-X

9786610479719

1-84544-723-9

Descrizione fisica

1 online resource (69 p.)

Collana

Soldering & surface mount technology ; ; v.14, no. 1

Altri autori (Persone)

BaileyChris

Disciplina

621.381531

Soggetti

Solder and soldering - Mathematical models

Surface mount technology - Mathematical models

Electronic books.

Lingua di pubblicazione

Inglese

Formato

Materiale a stampa

Livello bibliografico

Monografia

Note generali

Description based upon print version of record.

Nota di contenuto

Contents; Abstracts & keywords; Editorial; Correlation of solder paste rheology with computational simulations of the stencil printing process; Solder paste reflow modeling; Numerical modelling of scanned beam laser soldering of fine pitch packages; A simplified model of the reflow soldering process; CFD modelling of the flow field inside a reflow oven; Analysis on solder ball shear testing conditions with a simple computational model; Optimisation modelling for flip-chip solder joint reliability; Internet commentary; Book review; Industry news; Appointments; International diary

Note from the publisher

Sommario/riassunto

This special issue of SSMT brings together seven papersdemonstrating the latest achievements in the applications ofcomputational modelling technology to soldering processesand solder joint reliability.Why use computational models?The performance of soldering materials during productassembly is governed by complex interacting physicalphenomena.