LTB-3D : 2019 6th International Workshop on Low Temperature Bonding for 3D Integration : proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, May 21 -25, 2019, Kanazawa, Ishikawa, Japan / / Institute of Electrical and Electronics Engineers

• Record Nr.: UNINA9910326658803321
• Pubbl/distr/stampa: Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019
• ISBN: 4-904743-07-5
• Descrizione fisica: 1 online resource (90 pages)
• Disciplina: 621.885
• Soggetti: Three-dimensional integrated circuits; Sealing (Technology); Photonics - Materials
• Lingua di pubblicazione: Inglese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia