1.

Record Nr.

UNINA9910830439703321

Autore

Defaÿ Emmanuel

Titolo

Ferroelectric dielectrics integrated on silicon [[electronic resource] /] / edited by Emmanuel Defay

Pubbl/distr/stampa

London, : ISTE Ltd.

Hoboken, N.J., : John Wiley, 2011

ISBN

1-118-60275-7

1-118-60276-5

1-118-60280-3

Edizione

[1st edition]

Descrizione fisica

1 online resource (464 p.)

Collana

ISTE

Altri autori (Persone)

DefaÿEmmanuel

Disciplina

621.3815/2

621.38152

Soggetti

Ferroelectric thin films

Silicon - Electric properties

Electric batteries - Corrosion

Lingua di pubblicazione

Inglese

Formato

Materiale a stampa

Livello bibliografico

Monografia

Note generali

Adapted and updated from: Dielectriques ferroelectriques integres sur silicium, published in France by Hermes Science/Lavoisier, 2011.

Nota di bibliografia

Includes bibliographical references and index.

Nota di contenuto

Cover; Title Page; Copyright Page; Table of Contents; Preface; Chapter 1. The Thermodynamic Approach; 1.1. Background; 1.2. The functions of state; 1.3. Linear equations, piezoelectricity; 1.4. Nonlinear equations, electrostriction; 1.5. Thermodynamic modeling of the ferroelectric-paraelectricphase transition; 1.5.1. Assumption on the elastic Gibbs energy; 1.5.2. Second-order transition; 1.5.3. Effect of stress; 1.5.4. First-order transition; 1.6. Conclusion; 1.7. Bibliography; Chapter 2. Stress Effect on Thin Films; 2.1. Introduction; 2.2. Modeling the system under consideration

2.3. Temperature-misfit strain phase diagrams for monodomain films2.3.1. Phase diagram construction from the Landau-Ginzburg-Devonshire theory; 2.3.2. Calculations limitations; 2.4. Domain stability map; 2.4.1. Presentation and description of the framework of study; 2.4.2. Main contributions to the total energy of a film; 2.4.3. Influence of thickness; 2.4.4. Macroscopic elastic energy for each type of tetragonal domain; 2.4.5. Indirect interaction energy; 2.4.6. Domain



structures at equilibrium; 2.4.7. Domain stability map; 2.5. Temperature-misfit strain phase diagram for polydomain films

2.6. Discussion of the nature of the "misfit strain"2.6.1. Mechanical misfit strain; 2.6.2. Thermodynamic misfit strain; 2.6.3. As an illustration; 2.7. Conclusion; 2.8. Experimental validation of phase diagrams: state of the art; 2.9. Case study; 2.10. Results; 2.10.1. Evolution of the lattice parameters; 2.10.2. Associated stresses and strains; 2.11. Comparison between the experimental data and the temperature-misfit strain phase diagrams; 2.11.1. Thin film of PZT; 2.11.2. Thin layer of PbTiO3; 2.12. Conclusion; 2.13. Bibliography; Chapter 3. Deposition and Patterning Technologies

3.1. Deposition method3.1.1. Cathodic sputtering; 3.1.2. Ion beam sputtering; 3.1.3. Pulsed laser deposition; 3.1.4. The sol-gel process; 3.1.5. The MOCVD; 3.1.6. Molecular beam epitaxy; 3.2. Etching; 3.2.1. Wet etching; 3.2.2. Dry etching; 3.3. Contamination; 3.4. Monocrystalline thin-film transfer; 3.4.1. Smart CutTM technology; 3.4.2. Bonding/thinning; 3.4.3. Interest in the material in a thin layer; 3.4.4. State of the art of the domain/applications; 3.4.5. An exemplary implementation; 3.5. Design of experiments; 3.5.1. The assumptions; 3.5.2. Reproducibility

3.5.3. How can we reduce the number of experiments?3.5.4. A DOE example: PZT RF magnetron sputtering deposition; 3.6. Conclusion; 3.7. Bibliography; Chapter 4. Analysis Through X-ray Diffraction of Polycrystalline Thin Films; 4.1. Introduction; 4.2. Some reminders of X-ray diffraction and crystallography; 4.2.1. Nature of X-rays; 4.2.2. X-ray scattering and diffraction; 4.3. Application to powder or polycrystalline thin-films; 4.4. Phase analysis by X-ray diffraction; 4.4.1. Grazing incidence diffraction; 4.4.2. De-texturing; 4.4.3. Quantitative analysis

4.5. Identification of coherent domain sizes of diffraction and micro-strains

Sommario/riassunto

This book describes up-to-date technology applied to high-K materials for More Than Moore applications, i.e. microsystems applied to microelectronics core technologies.After detailing the basic thermodynamic theory applied to high-K dielectrics thin films including extrinsic effects, this book emphasizes the specificity of thin films. Deposition and patterning technologies are then presented. A whole chapter is dedicated to the major role played in the field by X-Ray Diffraction characterization, and other characterization techniques are also described such as Radio frequency characterizat



2.

Record Nr.

UNINA9910299981803321

Titolo

Models, Algorithms and Technologies for Network Analysis : From the Third International Conference on Network Analysis / / edited by Mikhail V. Batsyn, Valery A. Kalyagin, Panos M. Pardalos

Pubbl/distr/stampa

Cham : , : Springer International Publishing : , : Imprint : Springer, , 2014

ISBN

3-319-09758-X

Edizione

[1st ed. 2014.]

Descrizione fisica

1 online resource (145 p.)

Collana

Springer Proceedings in Mathematics & Statistics, , 2194-1009 ; ; 104

Disciplina

003.3

004

510

515

518

519.6

621

Soggetti

Mathematical optimization

Physics

Mathematical analysis

Analysis (Mathematics)

Computer science - Mathematics

Computer software

Mathematical models

Optimization

Applications of Graph Theory and Complex Networks

Analysis

Computational Mathematics and Numerical Analysis

Mathematical Software

Mathematical Modeling and Industrial Mathematics

Lingua di pubblicazione

Inglese

Formato

Materiale a stampa

Livello bibliografico

Monografia

Note generali

Description based upon print version of record.

Nota di bibliografia

Includes bibliographical references.

Nota di contenuto

A method of static and dynamic pattern analysis of innovative



development of Russian regions in the long run -- Using mathematical programming to refine heuristic solutions for network clustering -- Market graph construction using the performance measure of similarity -- How independent are stocks in an independent set of a market graph -- Analysis of Russian industries in the stock market -- A particle swarm optimization algorithm for the multicast routing problem -- König graphs for 4-paths -- A hybrid metaheuristic for routing on multicast networks -- Possible ways of applying citations network analysis to a scientific writing assistant -- Bounding fronts in multi-objective combinatorial optimization with application to aesthetic drawing of business process diagrams.

Sommario/riassunto

This volume compiles the major results of conference participants from the "Third International Conference in Network Analysis" held at the Higher School of Economics, Nizhny Novgorod in May 2013, with the aim to initiate further joint research among different groups. The contributions in this book cover a broad range of topics relevant to the theory and practice of network analysis, including the reliability of complex networks, software, theory, methodology, and applications.  Network analysis has become a major research topic over the last several years. The broad range of applications that can be described and analyzed by means of a network has brought together researchers, practitioners from numerous fields such as operations research, computer science, transportation, energy, biomedicine, computational neuroscience and social sciences. In addition, new approaches and computer environments such as parallel computing, grid computing, cloud computing, and quantum computing have helped to solve large scale network optimization problems.