|
|
|
|
|
|
|
|
|
1. |
Record Nr. |
UNINA9910299588803321 |
|
|
Autore |
Cheng Jie |
|
|
Titolo |
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect / / by Jie Cheng |
|
|
|
|
|
|
|
Pubbl/distr/stampa |
|
|
Singapore : , : Springer Singapore : , : Imprint : Springer, , 2018 |
|
|
|
|
|
|
|
ISBN |
|
|
|
|
|
|
Edizione |
[1st ed. 2018.] |
|
|
|
|
|
Descrizione fisica |
|
1 online resource (XVIII, 137 p. 103 illus.) |
|
|
|
|
|
|
Collana |
|
Springer Theses, Recognizing Outstanding Ph.D. Research, , 2190-5053 |
|
|
|
|
|
|
|
|
Disciplina |
|
|
|
|
|
|
Soggetti |
|
Manufactures |
Tribology |
Corrosion and anti-corrosives |
Coatings |
Electronics |
Microelectronics |
Manufacturing, Machines, Tools, Processes |
Tribology, Corrosion and Coatings |
Electronics and Microelectronics, Instrumentation |
|
|
|
|
|
|
|
|
Lingua di pubblicazione |
|
|
|
|
|
|
Formato |
Materiale a stampa |
|
|
|
|
|
Livello bibliografico |
Monografia |
|
|
|
|
|
Nota di bibliografia |
|
Includes bibliographical references. |
|
|
|
|
|
|
Sommario/riassunto |
|
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research. |
|
|
|
|
|
|
|
| |