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Record Nr. |
UNINA9910299492803321 |
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Autore |
Noia Brandon |
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Titolo |
Design-for-test and test optimization techniques for TSV-based 3D stacked ICs / / Brandon Noia, Krishnendu Chakrabarty ; foreword by Vishwani Agrawal |
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Pubbl/distr/stampa |
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Cham, Switzerland : , : Springer, , 2014 |
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ISBN |
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Edizione |
[1st ed. 2014.] |
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Descrizione fisica |
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1 online resource (xviii, 245 pages) : illustrations (chiefly color) |
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Collana |
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Disciplina |
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004.1 |
537.622 |
620 |
621.3815 |
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Soggetti |
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Three-dimensional integrated circuits |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references. |
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Nota di contenuto |
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Introduction -- Wafer Stacking and 3D Memory Test -- Built-in Self-Test for TSVs -- Pre-Bond TSV Test Through TSV Probing -- Pre-Bond TSV Test Through TSV Probing -- Overcoming the Timing Overhead of Test Architectures on Inter-Die Critical Paths -- Post-Bond Test Wrappers and Emerging Test Standards -- Test-Architecture Optimization and Test Scheduling -- Conclusions. |
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Sommario/riassunto |
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This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable. • Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICs; • Includes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizations; • Encompasses all |
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