1.

Record Nr.

UNINA9910298642203321

Titolo

Atomic layer deposition for semiconductors / / Cheol Seong Hwang, editor

Pubbl/distr/stampa

New York : , : Springer, , 2014

ISBN

1-4614-8054-X

Edizione

[1st ed. 2014.]

Descrizione fisica

1 online resource (x, 263 pages) : illustrations (some color)

Collana

Gale eBooks

Disciplina

621.38152

Soggetti

Semiconductors - Surfaces

Lingua di pubblicazione

Inglese

Formato

Materiale a stampa

Livello bibliografico

Monografia

Note generali

Description based upon print version of record.

Nota di bibliografia

Includes bibliographical references and index.

Nota di contenuto

Introduction -- Precursors and reaction mechanisms -- ALD simulations -- ALD for mass-production memories (DRAM and Flash) -- ALD for emerging memories -- PcRAM -- FeRAM -- Front end of the line process -- Back end of the line -- ALD machines.

Sommario/riassunto

Atomic Layer Deposition (ALD) was originally designed for depositing uniform passivation layers over a very large area  for display devices in the late 1970s. Only recently, in the 21st century, has the this technique become popular for high integrated semiconductor memory devices. This book discusses ALD for all modern semiconductor devices, the basic chemistry of ALD, and models of ALD processes. The book also details ALD for both mass produced memories and emerging memories. Each chapter of the book provides history, operating principles, and a full explanation of ALD processes for each device.