1.

Record Nr.

UNINA9910254605603321

Titolo

Multiscale Paradigms in Integrated Computational Materials Science and Engineering : Materials Theory, Modeling, and Simulation for Predictive Design / / edited by Pierre Deymier, Keith Runge, Krishna Muralidharan

Pubbl/distr/stampa

Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016

ISBN

3-319-24529-5

Edizione

[1st ed. 2016.]

Descrizione fisica

1 online resource (305 p.)

Collana

Springer Series in Materials Science, , 0933-033X ; ; 226

Disciplina

003.3

Soggetti

Physics

Optical materials

Electronic materials

Solid state physics

Applied mathematics

Engineering mathematics

Nanotechnology

Numerical and Computational Physics, Simulation

Optical and Electronic Materials

Solid State Physics

Mathematical and Computational Engineering

Lingua di pubblicazione

Inglese

Formato

Materiale a stampa

Livello bibliografico

Monografia

Note generali

Description based upon print version of record.

Nota di bibliografia

Includes bibliographical references at the end of each chapters and index.

Nota di contenuto

Orbital-free Density Functional Theory (OFDFT) -- Path Integral Molecular Dynamics (PIMD) -- Interatomic Potentials Including Chemistry -- Consistent Embedding -- Nano- and Meso-Scale Materials Phenomena -- Phase Field Methods -- Multiscale Spatial and Temporal Data Fusion and Fission in Materials -- Multiscaling and Materials Imaging -- Peridynamics -- Conclusions and Industrial Perspectives.

Sommario/riassunto

This book presents cutting-edge concepts, paradigms, and research highlights in the field of computational materials science and engineering, and provides a fresh, up-to-date perspective on solving



present and future materials challenges. The chapters are written by not only pioneers in the fields of computational materials chemistry and materials science, but also experts in multi-scale modeling and simulation as applied to materials engineering. Pedagogical introductions to the different topics and continuity between the chapters are provided to ensure the appeal to a broad audience and to address the applicability of integrated computational materials science and engineering for solving real-world problems.