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Record Nr. |
UNINA9910254250703321 |
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Autore |
Vaisband Inna P |
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Titolo |
On-Chip Power Delivery and Management [[electronic resource] /] / by Inna P. Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman |
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Pubbl/distr/stampa |
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Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016 |
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ISBN |
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Edizione |
[4th ed. 2016.] |
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Descrizione fisica |
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1 online resource (750 p.) |
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Disciplina |
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Soggetti |
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Electronic circuits |
Electronics |
Microelectronics |
Circuits and Systems |
Electronics and Microelectronics, Instrumentation |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Description based upon print version of record. |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Nota di contenuto |
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From the Contents: Introduction -- Inductive Properties of Electric Circuits -- Properties of On-Chip Inductive Current Loops -- Electromigration -- Scaling Trends of On-Chip Power Distribution Noise -- High Performance Power Distribution Systems -- On-Chip Power Distribution Networks -- Computer-Aided Design and Analysis -- Closed Form Expressions for Fast IR Drop Analysis. |
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Sommario/riassunto |
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This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, |
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advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks. |
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