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1. |
Record Nr. |
UNINA9910145661303321 |
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Titolo |
PMA 2006 : Second International Symposium on Plant Growth Modeling, Simulation, Visualization and their Applications : proceedings, 13-17 October 2006, Beijing, P.R. China |
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Pubbl/distr/stampa |
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[Place of publication not identified], : IEEE Computer Society, 2007 |
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ISBN |
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Disciplina |
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Soggetti |
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Growth (Plants) - Mathematical models |
Growth (Plants) - Data processing |
Botany |
Earth & Environmental Sciences |
Plant Physiology |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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Bibliographic Level Mode of Issuance: Monograph |
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2. |
Record Nr. |
UNINA9911018835503321 |
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Titolo |
Reliability of MEMS / / edited by Osamu Tabata and Toshiyuki Tsuchiya |
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Pubbl/distr/stampa |
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Weinheim, : Wiley-VCH, c2008 |
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ISBN |
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1-281-94693-1 |
9786611946937 |
3-527-62213-6 |
3-527-62256-X |
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Edizione |
[11th ed.] |
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Descrizione fisica |
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Collana |
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Advanced micro & nanosystems ; ; v.6 |
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Altri autori (Persone) |
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TsuchiyaToshiyuki |
TabataOsamu <1956-> |
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Disciplina |
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Soggetti |
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Microelectromechanical systems - Reliability |
Electrical engineering |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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Note generali |
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"Testing of materials and devices". |
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Nota di bibliografia |
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Includes bibliographical references and index. |
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Sommario/riassunto |
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This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS. |
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