|
|
|
|
|
|
|
|
1. |
Record Nr. |
UNINA9910141346803321 |
|
|
Titolo |
Advanced interconnects for ULSI technology [[electronic resource] /] / edited by Mikhail Baklanov, Paul S. Ho and Ehrenfried Zschech |
|
|
|
|
|
|
|
Pubbl/distr/stampa |
|
|
Chichester, West Susex, : Wiley, 2012 |
|
|
|
|
|
|
|
ISBN |
|
1-119-96686-8 |
1-119-96367-2 |
1-280-59080-7 |
9786613620637 |
1-119-96324-9 |
|
|
|
|
|
|
|
|
Edizione |
[2nd ed.] |
|
|
|
|
|
Descrizione fisica |
|
1 online resource (615 p.) |
|
|
|
|
|
|
Classificazione |
|
|
|
|
|
|
Altri autori (Persone) |
|
BaklanovMikhail |
HoP. S |
ZschechEhrenfried |
|
|
|
|
|
|
|
|
Disciplina |
|
|
|
|
|
|
Soggetti |
|
Integrated circuits - Ultra large scale integration |
Interconnects (Integrated circuit technology) |
|
|
|
|
|
|
|
|
Lingua di pubblicazione |
|
|
|
|
|
|
Formato |
Materiale a stampa |
|
|
|
|
|
Livello bibliografico |
Monografia |
|
|
|
|
|
Note generali |
|
Description based upon print version of record. |
|
|
|
|
|
|
Nota di bibliografia |
|
Includes bibliographical references and index. |
|
|
|
|
|
|
Nota di contenuto |
|
Advanced Interconnects for ULSI Technology; Contents; About the Editors; List of Contributors; Preface; Abbreviations; Section I Low-k Materials; 1 Low-k Materials: Recent Advances; 1.1 Introduction; 1.2 Integration Challenges; 1.2.1 Process-Induced Damage; 1.2.2 Mechanical Properties; 1.3 Processing Approaches to Existing Integration Issues; 1.3.1 Post-deposition Treatments; 1.3.2 Prevention or Repair of Plasma-Induced Processing Damage; 1.3.3 Multilayer Structures; 1.4 Material Advances to Overcome Current Limitations; 1.4.1 Silica Zeolites; 1.4.2 Hybrid Organic-Inorganic: Oxycarbosilanes |
1.5 ConclusionReferences; 2 Ultra-Low-k by CVD: Deposition and Curing; 2.1 Introduction; 2.2 Porogen Approach by PECVD; 2.2.1 Precursors and Deposition Conditions; 2.2.2 Mystery Still Unsolved: From Porogens to Pores; 2.3 UV Curing; 2.3.1 General Overview of Curing; 2.3.2 UV Curing Mechanisms; 2.4 Impact of Curing on Structure and Physical Properties: Benefits of UV Curing; 2.4.1 Porosity; 2.4.2 Chemical Structure and Mechanical Properties; 2.4.3 Electrical |
|
|
|
|