|
|
|
|
|
|
|
|
1. |
Record Nr. |
UNINA9910141296603321 |
|
|
Autore |
Li Er-Ping |
|
|
Titolo |
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / / Er-Ping Li |
|
|
|
|
|
|
|
Pubbl/distr/stampa |
|
|
[United States] : , : IEEE Press |
|
Hoboken [New Jersey] : , : Wiley |
|
[Piscataqay, New Jersey] : , : IEEE Xplore, , [2012] |
|
|
|
|
|
|
|
|
|
ISBN |
|
1-280-67311-7 |
9786613650047 |
1-118-16674-4 |
1-118-16672-8 |
1-118-16675-2 |
|
|
|
|
|
|
|
|
Descrizione fisica |
|
1 online resource (390 p.) |
|
|
|
|
|
|
Classificazione |
|
|
|
|
|
|
Disciplina |
|
|
|
|
|
|
Soggetti |
|
Three-dimensional integrated circuits |
Integrated circuits |
|
|
|
|
|
|
|
|
Lingua di pubblicazione |
|
|
|
|
|
|
Formato |
Materiale a stampa |
|
|
|
|
|
Livello bibliografico |
Monografia |
|
|
|
|
|
Note generali |
|
Description based upon print version of record. |
|
|
|
|
|
|
Nota di bibliografia |
|
Includes bibliographical references and index. |
|
|
|
|
|
|
Nota di contenuto |
|
Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. |
|
|
|
|
|
|
|
|
Sommario/riassunto |
|
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and |
|
|
|
|
|
|
|