Maximum-entropy and Bayesian methods in inverse problems / edited by C. Ray Smith and W.T. Grandy, Jr

• Record Nr.: UNICAMPANIASUN0045514
• Pubbl/distr/stampa: Dordrecht ; Lancaster : Reidel, 1985
• ISBN: 90-277-2074-6
• Descrizione fisica: IX, 492 p. : ill. ; 25 cm.
• Disciplina: 001.53'9
• Lingua di pubblicazione: Inglese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia

Microengineering of metals and ceramics . Part I Design, tooling and injection molding [[electronic resource] /] / volume editors, Detlef Löhe and Jürgen Haubelt

• Record Nr.: UNINA9910830532503321
• Pubbl/distr/stampa: Weinheim, : Wiley-VCH, c2005
• ISBN: 1-281-84298-2; 9786611842987; 3-527-61672-1; 3-527-61694-2
• Descrizione fisica: 1 online resource (394 p.)
• Collana: Advanced micro & nanosystems ; ; v. 3
• Altri autori (Persone): LöheDetlef; HausseltJürgen
• Disciplina: 620.14
• Soggetti: Micromechanics; Ceramic materials - Microstructure; Metals - Microstructure; Microtechnology; Injection molding of ceramics; Injection molding of metals
• Lingua di pubblicazione: Inglese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Note generali: Description based upon print version of record.
• Nota di bibliografia: Includes bibliographical references and indexes.
• Nota di contenuto: Advanced Micro & Nanosystems Volume 3 Microengineering of Metals and Ceramics; Preface; Foreword; Contents; List of Contributors; Subject Index; I Design; 1 Design Environment and Design Flow; 2 Modeling and Validation in Design; 3 Modeling Micro PIM; II Tooling; 4 Strategies for the Manufacture of Mold Inserts; 5 Micro End Milling of Hardened Steel; 6 3D Microstructuring of Mold Inserts by Laser-based Removal; 7 Micro-EDM for Mold Inserts; 8 Lithographic Fabrication of Mold Inserts; 9 Material States and Surface Conditioning for Mold Inserts; III Replication Techniques - Microinjection Molding10 Microinjection Molding - Principles and Challenges; 11 Micro Metal Injection Molding; 12 Micro Ceramic Injection Molding
• Sommario/riassunto: Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps.In this volume, authors from three major competence centres for microengineering illustrate step by step the process from designing and simulating microcomponents of